GlobalFoundries (GFS) Announces Production Readiness of SLATE Wafer-to-Wafer Bonding Technology

July 13, 2026 - 02:41

GlobalFoundries Inc. has announced that its SLATE wafer-to-wafer bonding technology is now ready for production. The new capability is built on the company's 9SW radio-frequency silicon-on-insulator platform and is being manufactured at its 300mm facility in Singapore. This 3D integration solution is expected to move into volume production in the coming months.

The SLATE technology allows for the direct bonding of two wafers, enabling tighter integration of components. This approach is particularly important for advanced radio-frequency and mixed-signal applications, where performance and space are critical. By stacking wafers instead of placing chips side by side, manufacturers can reduce the overall footprint of a device while improving signal integrity and power efficiency.

GlobalFoundries has positioned this technology as a key enabler for next-generation wireless systems, including 5G and beyond. The company's focus on specialty foundry services, rather than bleeding-edge node scaling, has made it a notable player in the semiconductor space. As demand for connectivity and sensor solutions continues to grow, the SLATE platform could help GlobalFoundries capture more business from customers looking for reliable, high-volume manufacturing of stacked devices. The move also reflects a broader industry trend toward heterogeneous integration, where different types of chips are combined in a single package to achieve better performance without shrinking transistor sizes.